Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2007-03-08
2009-06-02
Chen, Kin-Chan (Department: 1792)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S700000, C438S717000, C438S723000
Reexamination Certificate
active
07541290
ABSTRACT:
Methods of forming integrated circuit devices include steps to selectively widen portions of a mask pattern extending adjacent an outer edge of a semiconductor wafer. These steps to selectively widen portions of the mask pattern are performed so that more uniform center-to-edge critical dimensions (CD) can be achieved when the mask pattern is used to support photolithographically patterning of underlying layers (e.g., insulating layers, antireflective coatings, etc.).
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Chang Chong Kwang
Lipinsky Matthias
Mishra Shailendra
Park Wan Jae
Tsou Len Yuan
Chartered Semiconductor Manufacturing Ltd.
Chen Kin-Chan
Infineon - Technologies AG
International Business Machines - Corporation
Myers Bigel & Sibley & Sajovec
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