Methods of forming interposers on surfaces of dies of a wafer

Details Methods of forming interposers on surfaces of dies of a wafer Methods of forming interposers on surfaces of dies of a wafer

2007-04-24

2007-04-24

Pham, Thanhha S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S458000

Reexamination Certificate

active

10867446

ABSTRACT:
A method and apparatus to stencil interposers on a wafer of dies is described. In one embodiment, an interposer stenciling apparatus includes an interposer forming stencil configured to deposit interposer material onto a backside of a wafer of dies in a predetermined formation. In another embodiment, another interposer forming stencil is configured to form additional interposer layers on existing interposers to support dies thereon having different size configurations.

REFERENCES:
patent: 5468681 (1995-11-01), Pasch
patent: 5644167 (1997-07-01), Weiler et al.
patent: 5821624 (1998-10-01), Pasch
patent: 6022761 (2000-02-01), Grupen-Shemansky et al.
patent: 6054337 (2000-04-01), Solberg
patent: 6197613 (2001-03-01), Kung et al.
patent: 6376769 (2002-04-01), Chung
patent: 6413798 (2002-07-01), Asada
patent: 6743699 (2004-06-01), Doan
patent: 6933172 (2005-08-01), Tomimatsu
patent: 2002/0162215 (2002-11-01), Kledzik
patent: 2003/0027373 (2003-02-01), Distefano et al.

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