Methods of forming inductors on integrated circuits

Details Methods of forming inductors on integrated circuits Methods of forming inductors on integrated circuits

2008-10-13

2011-10-25

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S605000, C029S607000, C029S829000, C029S832000, C216S062000, C216S065000, C216S066000, C216S067000, C336S178000, C336S200000, C336S212000, C336S223000, C336S232000

Reexamination Certificate

active

08042260

ABSTRACT:
The claimed invention pertains to methods of forming one or more inductors on a semiconductor substrate. In one embodiment, a method of forming an array of inductor core elements on a semiconductor substrate that includes integrated circuits is disclosed. A first set of spaced apart metallic core elements are formed over the substrate. Isolation sidewalls are then formed on side surfaces of the core elements. Afterward, a second set of metallic core elements are formed over the substrate. The first and second sets of core elements are substantially co-planar and interleaved such that only the isolation sidewalls separate adjacent core elements. Particular embodiments involve other processing operations, such as the selective electroplating of different types of metal to form core elements and/or the deposition and etching away of an isolation layer to form isolation sidewalls on the core elements.

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