Metal working – Method of mechanical manufacture – Electrical device making
Patent
1994-09-09
1995-12-12
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29830, 29852, 2281801, 257713, 361693, 427 97, H05K 334, H05K 336, H05K 342, H05K 346
Patent
active
054738130
ABSTRACT:
A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith. An electrically insulating material is deposited on at least one side of each of the conductive planes. The planes are placed on top of each other such that a layer of electrically insulating material is located between each of the conductive planes. The conductive planes are joined together to form the multi-layer circuit board or card.
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I-Con Industries Discrete Wiring High Speed Electrical Test Board, One page, Euless, Texas, Date Unknown.
Chobot Ivan I.
Covert John A.
Haight Randy L.
Mansfield Keith D.
Miller Donald W.
International Business Machines - Corporation
Vo Peter
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