Methods of forming conductive lines, methods of forming antennas

Details Methods of forming conductive lines, methods of forming antennas Methods of forming conductive lines, methods of forming antennas

1997-09-09

2000-06-27

Wong, Don

Communications: radio wave antennas

Antennas

With housing or protective covering

343700MS, 343795, 156630, 361410, H01Q 138

Patent

active

060812435

ABSTRACT:
Methods of forming conductive lines, antennas, and wireless communications devices, and related conductive lines, antennas and wireless communications devices are described. In one aspect, a substrate having an outer surface is provided. A first layer of conductive material is formed over the outer surface. A second layer of conductive material is formed over only portions of the first layer. Using the second layer as a masking layer, the first layer is etched selectively relative thereto to provide a conductive line comprising the first and second layers. Preferably, the first layer is more conductive than the second layer. In a preferred implementation, the conductive line constitutes an antenna construction which is suitable for use in a wireless communications device. In another preferred implementation, an antenna, an integrated circuitry chip, and a battery are mounted on a substrate and operably interconnected to provide an integrated circuitry chip, with the antenna being formed as described above.

REFERENCES:
patent: 4987421 (1991-01-01), Sunahara et al.
patent: 5148355 (1992-09-01), Lowe et al.
patent: 5364493 (1994-11-01), Hunter, Jr. et al.
patent: 5475241 (1995-12-01), Harrah et al.
patent: 5495260 (1996-02-01), Couture
U.S. Application No. 08/705,043, O'Toole et al., filed Aug. 29, 1996.
Sedlak, "Etching Outerlayer Printed Circuit Boards", RD Chemical Company, 1995-1996.

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