Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2008-04-04
2010-02-16
Le, Thao X (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S707000, C257S715000, C257S716000, C257S717000
Reexamination Certificate
active
07663230
ABSTRACT:
A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.
REFERENCES:
patent: 5548907 (1996-08-01), Gourdine
patent: 2004/0190253 (2004-09-01), Prasher et al.
Cheng Chin Chang
Myers Alan M.
Ramanathan Shriram
Intel Corporation
Le Thao X
Nelson Kenneth A.
Tran Thanh Y
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