Methods of forming channels on an integrated circuit die and...

Details Methods of forming channels on an integrated circuit die and... Methods of forming channels on an integrated circuit die and...

2005-07-19

2005-07-19

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S714000, C257S717000

Reexamination Certificate

active

06919231

ABSTRACT:
A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.

REFERENCES:
patent: 6605525 (2003-08-01), Lu et al.
Youngcheol Joo et al, Fabrication of Monolithic Microchannels For IC Chip Cooling, 1995 IEEE, pp. 362-367.

Affiliated with

Also associated with

Rating

Methods of forming channels on an integrated circuit die and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of forming channels on an integrated circuit die and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming channels on an integrated circuit die and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3374595