Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2011-02-22
2011-02-22
Kebede, Brook (Department: 2894)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
C257SE27048
Reexamination Certificate
active
07892937
ABSTRACT:
Some embodiments include methods of forming capacitors. Storage nodes are formed within a material. The storage nodes have sidewalls along the material. Some of the material is removed to expose portions of the sidewalls. The exposed portions of the sidewalls are coated with a substance that isn't wetted by water. Additional material is removed to expose uncoated regions of the sidewalls. The substance is removed, and then capacitor dielectric material is formed along the sidewalls of the storage nodes. Capacitor electrode material is then formed over the capacitor dielectric material. Some embodiments include methods of utilizing a silicon dioxide-containing masking structure in which the silicon dioxide of the masking structure is coated with a substance that isn't wetted by water.
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Greeley Neil
Hofmann Jim
Raghu Prashant
Rana Niraj
Sinha Nishant
Kebede Brook
Micro)n Technology, Inc.
Wells St. John P.S.
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