Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2006-01-10
2006-01-10
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S157000, C438S239000, C438S243000
Reexamination Certificate
active
06984301
ABSTRACT:
The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.
REFERENCES:
patent: 6171952 (2001-01-01), Sandhu et al.
patent: 6197181 (2001-03-01), Chen
patent: 6355153 (2002-03-01), Uzoh et al.
patent: 6503791 (2003-01-01), Matsui et al.
patent: 6703272 (2004-03-01), Taylor et al.
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2001/0055851 (2001-12-01), Horti
patent: 2002/0048870 (2002-04-01), Lane
patent: 2004/0043559 (2004-03-01), Srividya et al.
patent: 0 930 647 (1999-07-01), None
patent: 1 167 585 (2002-01-01), None
patent: 5-243222 (1993-09-01), None
patent: 05243222 (1993-09-01), None
patent: 2003-31688 (2003-01-01), None
patent: 03/21637 (2003-10-01), None
Collins Dale W.
Klein Rita J.
Lane Richard H.
Micro)n Technology, Inc.
Wells St. John P.S.
Wong Edna
LandOfFree
Methods of forming capacitor constructions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of forming capacitor constructions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming capacitor constructions will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3537667