Methods of forming an apparatus for engaging electrically conduc

Details Methods of forming an apparatus for engaging electrically conduc Methods of forming an apparatus for engaging electrically conduc

1997-07-17

2000-10-03

Tsai, Jey

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438612, 324754, H01L 2166, G01R 3126

Patent

active

061271950

ABSTRACT:
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate; b) engaging the grouping of apexes with the single test pad on the semiconductor substrate; and c) sending an electric signal between the grouping of apexes and test pad to evaluate operability of integrated circuitry on the semiconductor substrate. Constructions and methods are disclosed for forming testing apparatus comprising an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate.

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