Methods of forming a patterned metal film on a support

Details Methods of forming a patterned metal film on a support Methods of forming a patterned metal film on a support

1981-12-15

1983-06-14

Louie, Jr., Won H.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427305, 427307, 427 98, 427404, 430314, 430315, 430324, 430414, B05D 304

Patent

active

043883516

ABSTRACT:
A printed circuit board is formed by forming a negative resist pattern over the surface of a substrate, etching the surface, sensitizing and catalyzing the surface, stripping the negative mask and catalytic layer thereover leaving a positive catalytic circuit pattern on the substrate and electrolessly plating copper over the catalytic image. A preferred variation of this method includes flash plating a thin porous electroless deposit over the catalyzed substrate prior to stripping the resist layer.

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Handbook of Thin Film Technology, edited by Leon I. Maissel and Reinhard Glang, McGraw-Hill Book Co., 1970, pp. 7-48 to 7-49.
Electronic News, Nov. 6, 1978, "64K Dynamic RAM-IBM Standard", p. 59.

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