Methods of forming a doped semiconductor thin film, doped...

Compositions: coating or plastic – Coating or plastic compositions – Silicon containing other than solely as silicon dioxide or...

Reexamination Certificate

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C106S187100, C252S182300, C252S182330, C252S182350, C252S182320

Reexamination Certificate

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10949013

ABSTRACT:
Methods for forming doped silane and/or semiconductor thin films, doped liquid phase silane compositions useful in such methods, and doped semiconductor thin films and structures. The composition is generally liquid at ambient temperatures and includes a Group IVA atom source and a dopant source. By irradiating a doped liquid silane during at least part of its deposition, a thin, substantially uniform doped oligomerized/polymerized silane film may be formed on a substrate. Such irradiation is believed to convert the doped silane film into a relatively high-molecular weight species with relatively high viscosity and relatively low volatility, typically by cross-linking, isomerization, oligomerization and/or polymerization. A film formed by the irradiation of doped liquid silanes can later be converted (generally by heating and annealing/recrystallization) into a doped, hydrogenated, amorphous silicon film or a doped, at least partially polycrystalline silicon film suitable for electronic devices. Thus, the present invention enables use of high throughput, low cost equipment and techniques for making doped semiconductor films of commercial quality and quantity from doped “liquid silicon.”

REFERENCES:
patent: 4554180 (1985-11-01), Hirooka
patent: 4683145 (1987-07-01), Nishimura et al.
patent: 4683146 (1987-07-01), Hirai et al.
patent: 4726963 (1988-02-01), Ishihara et al.
patent: 4830890 (1989-05-01), Kanai
patent: 4841083 (1989-06-01), Nagai et al.
patent: 5198387 (1993-03-01), Tang
patent: 5379720 (1995-01-01), Kuramata
patent: 5866471 (1999-02-01), Beppu et al.
patent: 6027705 (2000-02-01), Kitsuno et al.
patent: 6517911 (2003-02-01), Matsuki
patent: 6518087 (2003-02-01), Furusawa et al.
patent: 6527847 (2003-03-01), Matsuki
patent: 6541354 (2003-04-01), Shimoda et al.
patent: 6767775 (2004-07-01), Yudasaka et al.
patent: 6884700 (2005-04-01), Aoki et al.
patent: 7186630 (2007-03-01), Todd
patent: 2003/0022528 (2003-01-01), Todd
patent: 2003/0045632 (2003-03-01), Shiho et al.
patent: 2003/0229190 (2003-12-01), Aoki et al.
patent: 2005/0176183 (2005-08-01), Aoki et al.
patent: 2077710 (1983-10-01), None
patent: 60-242612 (1985-12-01), None
patent: 6-191821 (1994-07-01), None
patent: 7-267621 (1995-10-01), None
patent: 9-45922 (1997-02-01), None
patent: 10-195985 (2000-01-01), None
patent: WO 00/59041 (2000-10-01), None
Uwe Herzog & Robert West; Heterosubstituted Polysilanes (5 Pages); Macromolecules 1999, 32, 2210-2214; American Chemical Society, Mar. 9, 1999.
Inventors: Takadera Tsutomu, Fukuyama Keiichi, Sakawaki Akira, Yano Kotaro & Kitsuno Yutaka; Method for Forming Silicon Film and Manufacture of Solar Battery; Publication No. 2000031066; Patent Abstracts of Japan; Publication Date: Jan. 28, 2000; Applicant: Sharp Corp, Showa Denko KK.
Yutaka Kitsuno,Kotaro Yano, Akira Sakawaki, Keiji Kawasaki; Method for Forming Poly Crystal Silicon Film; Patent Abstracts of Japan; Publication Date: Feb. 14, 1997; Publication No. JP 09045922 A; Japanese Patent, Japan.
Kotaro Yano, Yutaka Kitsuno, Akira Sakawaki, Keiji Kawasaki; Formation of Silicon Membrane; Patent Abstracts of Japan; Publication Date: Oct. 17, 1995; Publication No. JP 07267621 A; Japanese Patent Office, Japan.
Kotaro Yano, Yutaka Kitsuno, Sholchl Tazawa, Keiji Kawasaki; Higher Order Silane Containing Solution for Forming Silicon Film; Patent Abstracts of Japan; Publication Date Jul. 12, 1994; Publication No. JP06191821 A; Japanese Patent Office, Japan.
Yukio Nishimura, Hiroshi Matsuda, Masahiro Haruta, Yutaka Hirai, Takeshi Eguchi, Takashi Katagiri; Deposition Film Forming Method; Patent Abstracts of Japan; Publication Date: Dec. 2, 1985; Publication No. JP 60242612 A; Japanese Patent Office, Japan.

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