Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-03-23
2009-06-23
Lee, Calvin (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Reexamination Certificate
active
07550841
ABSTRACT:
A diamond micro-channel structure disposed on a die, as well as methods of forming the same, are disclosed. One or more walls of each channel may comprise diamond (or other diamond-like material). The micro-channel structure may form part of a fluid cooling system for the die. Other embodiments are described and claimed.
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Intel Corporation
Lee Calvin
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