Methods of fabricating semiconductor devices including...

Details Methods of fabricating semiconductor devices including... Methods of fabricating semiconductor devices including...

2008-09-23

2008-09-23

Dang, Phuc T (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S257000, C257S288000

Reexamination Certificate

active

11443237

ABSTRACT:
A method of fabricating a semiconductor device includes forming an active region including opposing sidewalls and a surface therebetween protruding from a substrate. A protective insulating layer is formed on the sidewalls of the active region, and extends away from the substrate to beyond the surface of the active region. A device isolation layer is also formed on the opposing sidewalls of the active region, and extends along the protective insulating layer to beyond the surface of the active region. As such, the protective insulating layer may protect portions of the device isolation layer extending therealong during subsequent fabrication processes. Related devices are also discussed.

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Notice to File a Response/Amendment to the Examination Report corresponding to Korean Patent Application No. 10-2005-0051480 mailed Sep. 26, 2006.

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