Methods of fabricating printed circuit boards

Details Methods of fabricating printed circuit boards Methods of fabricating printed circuit boards

1978-06-29

1980-04-08

Crane, Daniel C.

Metal fusion bonding

Process

Plural joints

228223, 228 23, 228 35, B23K 108

Patent

active

041968395

ABSTRACT:
A printed circuit board is fabricated by a series of steps which eliminate the necessity of post soldering cleaning of the printed circuit assembly. The board is fabricated by positioning components on the top surface and uniformly applying a hydrophobic flux to the conductor surface of the board. The board is then passed through the crest of a wave of solder at a controlled temperature and for a controlled time. The solder wave is a single wave with a bidirectional flow. The application of the hydrophobic flux according to the methods and the subsequent wave soldering of the board enables removal of the board directly from the solder flow, and storage of the board for future use.

REFERENCES:
patent: 3122117 (1964-02-01), Marzullo et al.
patent: 3135630 (1964-06-01), Bielinski et al.
patent: 3407984 (1968-10-01), Walker
patent: 3439854 (1969-04-01), Walker
patent: 3588998 (1971-06-01), Corsaro
patent: 3723191 (1973-03-01), Bos et al.
patent: 3874068 (1975-04-01), Cook
patent: 4009816 (1977-03-01), Feuchtbaum et al.

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