Methods of fabricating of semiconductor package and mounting of

Details Methods of fabricating of semiconductor package and mounting of Methods of fabricating of semiconductor package and mounting of

1995-03-01

1997-05-13

Schwartz, Larry I.

Metal working

Method of mechanical manufacture

Electrical device making

29740, H05K 330

Patent

active

056281110

ABSTRACT:
A method of fabricating a semiconductor package comprising the steps of setting a semiconductor chip having a pad with protruding electrodes on an insulation board having a main surface on which a wiring circuit and connection terminals are formed and an other main surface on which flat-type external connecting terminals are formed, to align the protruding electrodes of the semiconductor chip with the connection terminals of the insulating board, wherein the insulating board is installed on a pressing stage, pressing the semiconductor chip onto the insulation board to connect the protruding electrodes to the connection terminals, clamping the semiconductor chip and the insulation board by clamping means to form a clamped unit which keeps the pressure on the semiconductor chip and the insulation board, transferring the clamped unit from the pressing stage to a resin supplying stage, supplying a sealing resin in a space formed between an upper surface of the circuit board and a lower surface of the semiconductor chip in the clamped unit, transferring the resin supplied unit from the resin supplying stage to a resin curing stage, curing the sealing resin filled in the space formed between the upper surface of the insulation board and the lower surface of the semiconductor chip in the clamped unit, and removing the clamping means from the clamped unit after the curing of the sealing resin is completed.

REFERENCES:
patent: 4715115 (1987-12-01), King et al.
patent: 5074947 (1991-12-01), Estes et al.
patent: 5232532 (1993-08-01), Hori

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