Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2011-06-21
2011-06-21
Chen, Jack (Department: 2893)
Semiconductor device manufacturing: process
Having organic semiconductive component
C438S455000, C257SE21001
Reexamination Certificate
active
07964439
ABSTRACT:
The invention provides a method of depositing a layer of a conductive material, e.g. metal, metal oxide or electroconductive polymer, from a patterned stamp, preferably a soft, elastomeric stamp, to a substrate after an organic layer has been transferred from a patterned stamp to an organic layer over the substrate. The patterned metal or organic layer may be used for example, in a wide range of electronic devices. The present methods are particularly suitable for nanoscale patterning of organic electronic components.
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Cao Yifang
Forrest Stephen
Kim Changsoon
Soboyejo Winston O.
Chen Jack
Kenyon & Kenyon LLP
The Trustees of Princeton University
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