Methods of fabricating applique circuits

Details Methods of fabricating applique circuits Methods of fabricating applique circuits

1997-03-04

1999-09-14

Hall, Carl E.

Metal working

Electric condenser making

Solid dielectric type

29424, 216 13, 216 20, 427 79, H01G 406

Patent

active

059502924

ABSTRACT:
Applique circuits suitable for advanced packaging applications are introduced. These structures are particularly suited for the simple integration of large amounts (many nanoFarads) of capacitance into conventional integrated circuit and multichip packaging technology. In operation, applique circuits are bonded to the integrated circuit or other appropriate structure at the point where the capacitance is required, thereby minimizing the effects of parasitic coupling. An immediate application is to problems of noise reduction and control in modern high-frequency circuitry.

REFERENCES:
patent: 5228184 (1993-07-01), Kishi
patent: 5573808 (1996-11-01), Gruenwald et al.
"Integrated Decoupling Capacitors using Pb(Zr,Ti)O.sub.3 Thin Films" D. Dimos, S.J. Lockwood, T.J. Garino, H.N. Al-Shareef, and R.W. Schwartz, Materials Research Society Symposium Proceedings vol. 433, pp. 305-316 (1996).

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