Methods of fabricating an HDMI decal chip scale package

Details Methods of fabricating an HDMI decal chip scale package Methods of fabricating an HDMI decal chip scale package

1997-03-20

1998-10-06

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438622, H01L 2144

Patent

active

058175415

ABSTRACT:
Methods of producing a chip scale package that enables any chip with peripheral bond pads to be converted to an area array chip scale package suitable for chip on board assembly. The present invention produces the equivalent of a flip chip die when a chip supplier does not provide one. Processing is performed that provides thin film metal interconnections between the chip bond pads and area array bond pads on the bottom of the package. High reliability thin film metal interconnections are thus provided that connect the bond pads of the chip to the area array bond pads to permit external connection to the chip.

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patent: 5262351 (1993-11-01), Bureau et al.
patent: 5514613 (1996-05-01), Sanradkea et al.
patent: 5691245 (1997-11-01), Bakhit et al.

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