Methods of etching through wafers and substrates with a composit

Details Methods of etching through wafers and substrates with a composit Methods of etching through wafers and substrates with a composit

1996-07-26

1999-04-06

Codd, Bernard P.

Etching a substrate: processes

Nongaseous phase etching of substrate

Etching inorganic substrate

216 41, 216100, 216108, 438597, 438619, 438753, 438756, 438757, B44C 122, H05K 306

Patent

active

058913548

ABSTRACT:
Methods of wet etching through a silicon substrate using composite etch-stop layers are disclosed. In one embodiment, the composite etch stop comprises a layer of silicon dioxide and a layer of polyimide.

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