Methods of encapsulating a semiconductor chip using a settable e

Details Methods of encapsulating a semiconductor chip using a settable e Methods of encapsulating a semiconductor chip using a settable e

1998-10-06

2000-06-27

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438125, 438127, 438108, H01L 2144, H01L 2148, H01L 2150

Patent

active

060806052

ABSTRACT:
A method of making a semiconductor chip package by attaching a chip to a dielectric layer; placing the dielectric layer and chip into a mold; disposing a thixotropic composition that has bee sheared to reduced its viscosity into the mold and curing the thixotropic composition after the chip and dielectric layer have been removed from the mold. A method of making a semiconductor chip package without using a mold by disposing a sheared thixotropic composition between a semiconductor chip and a dielectric layer and then curing the thixotropic composition to form a cured encapsulant. A method of making a semiconductor chip package without using a mold during the curing step and without the need to use a thixotropic composition by placing a semiconductor chip attached to a dielectric layer into a mold and disposing a liquid composition between the chip and the dielectric layer, forming a cured skin on the liquid composition, removing the work-piece from the mold and then completely the cure of the liquid composition.

REFERENCES:
patent: 4996170 (1991-02-01), Baird
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5659652 (1997-08-01), D'Entremont
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5688716 (1997-11-01), DiStefano et al.
patent: 5766987 (1998-06-01), Mitchell et al.
patent: 5773322 (1998-06-01), Weld
patent: 5776796 (1998-07-01), DiStefano et al.

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