Methods of dip soldering

Details Methods of dip soldering Methods of dip soldering

1975-09-09

1976-11-02

Smith, Al Lawrence

Metal fusion bonding

Process

Using high frequency vibratory energy

228 1, 228262, B23K 106, B23K 108

Patent

active

039891798

ABSTRACT:
A method is provided for eliminating "icicles" or ligaments and other manifestations of dripping solder from articles which are dip soldered by vibrating the articles simultaneously with removing them from the solder bath and continuing to vibrate the articles until the solder thereon has at least levelled.

REFERENCES:
patent: 2485444 (1949-10-01), Hofberg
patent: 3834015 (1974-09-01), Di Renzo

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