Methods of coating semiconductor light emitting elements by...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S027000, C257S013000, C257S098000, C257SE33067

Reexamination Certificate

active

07569407

ABSTRACT:
Semiconductor light emitting devices are fabricated by placing a suspension including phosphor particles suspended in solvent on at least a portion of a light emitting surface of a semiconductor light emitting element, and evaporating at least some of the solvent to cause the phosphor particles to deposit on at least a portion of the light emitting surface. A coating including phosphor particles is thereby formed on at least a portion of the light emitting surface. Particles other than phosphor also may be coated and solutions wherein particles are dissolved in solvent also may be used.

REFERENCES:
patent: 4733335 (1988-03-01), Serizawa et al.
patent: 4918497 (1990-04-01), Edmond
patent: 4935665 (1990-06-01), Murata
patent: 4946547 (1990-08-01), Palmour et al.
patent: 4966862 (1990-10-01), Edmond
patent: 5027168 (1991-06-01), Edmond
patent: 5200022 (1993-04-01), Kong et al.
patent: 5210051 (1993-05-01), Carter et al.
patent: 5277840 (1994-01-01), Osaka et al.
patent: 5338944 (1994-08-01), Edmond et al.
patent: RE34861 (1995-02-01), Davis
patent: 5393993 (1995-02-01), Edmond et al.
patent: 5416342 (1995-05-01), Edmond et al.
patent: 5523589 (1996-06-01), Edmond et al.
patent: 5604135 (1997-02-01), Edmond et al.
patent: 5614131 (1997-03-01), Mukerji et al.
patent: 5631190 (1997-05-01), Negley
patent: 5739554 (1998-04-01), Edmond et al.
patent: 5766987 (1998-06-01), Mitchell et al.
patent: 5813753 (1998-09-01), Vriens et al.
patent: 5858278 (1999-01-01), Itch et al.
patent: 5912477 (1999-06-01), Negley
patent: 5923053 (1999-07-01), Jakowetz et al.
patent: 5959316 (1999-09-01), Lowery
patent: 5998925 (1999-12-01), Shimizu
patent: 6001671 (1999-12-01), Fjelstad
patent: 6066861 (2000-05-01), Horn et al.
patent: 6069440 (2000-05-01), Shimizu et al.
patent: 6087202 (2000-07-01), Exposito et al.
patent: 6120600 (2000-09-01), Edmond et al.
patent: 6132072 (2000-10-01), Turnbull et al.
patent: 6139304 (2000-10-01), Centofante
patent: 6153448 (2000-11-01), Takahashi et al.
patent: 6187606 (2001-02-01), Edmond et al.
patent: 6201262 (2001-03-01), Edmond et al.
patent: 6252254 (2001-06-01), Soules et al.
patent: 6329224 (2001-12-01), Nguyen et al.
patent: 6331063 (2001-12-01), Kamada et al.
patent: 6338813 (2002-01-01), Hsu et al.
patent: 6376277 (2002-04-01), Corisis
patent: 6404125 (2002-06-01), Garbuzou
patent: 6531328 (2003-03-01), Chen
patent: 6583444 (2003-06-01), Fjelstad
patent: 6624058 (2003-09-01), Kazama
patent: 6642652 (2003-11-01), Collins, III
patent: 6653765 (2003-11-01), Levinson et al.
patent: 6733711 (2004-05-01), Durocher et al.
patent: 6759266 (2004-07-01), Hoffman
patent: 6791119 (2004-09-01), Slater, Jr. et al.
patent: 6793371 (2004-09-01), Lamke et al.
patent: 6812500 (2004-11-01), Reeh et al.
patent: 6853010 (2005-02-01), Slater, Jr. et al.
patent: 6860621 (2005-03-01), Bachl et al.
patent: 6919683 (2005-07-01), Jang
patent: 6958497 (2005-10-01), Emerson et al.
patent: 7023019 (2006-04-01), Maeda et al.
patent: 7029935 (2006-04-01), Negley et al.
patent: 7049159 (2006-05-01), Lowery
patent: 7183587 (2007-02-01), Negley et al.
patent: 7202598 (2007-04-01), Juestel et al.
patent: 7217583 (2007-05-01), Negley et al.
patent: 7286296 (2007-10-01), Chaves et al.
patent: 2002/0001869 (2002-01-01), Fjelstad
patent: 2002/0006040 (2002-01-01), Kamada et al.
patent: 2002/0070449 (2002-06-01), Yagi et al.
patent: 2002/0096789 (2002-07-01), Bolken
patent: 2002/0123164 (2002-09-01), Slater, Jr. et al.
patent: 2002/0185965 (2002-12-01), Collins, III et al.
patent: 2003/0006418 (2003-01-01), Emerson et al.
patent: 2003/0038596 (2003-02-01), Ho
patent: 2003/0066311 (2003-04-01), Li et al.
patent: 2003/0121511 (2003-07-01), Hashimura et al.
patent: 2003/0207500 (2003-11-01), Pichler et al.
patent: 2004/0004435 (2004-01-01), Hsu
patent: 2004/0012958 (2004-01-01), Hashimoto et al.
patent: 2004/0037949 (2004-02-01), Wright
patent: 2004/0038442 (2004-02-01), Kinsman
patent: 2004/0041222 (2004-03-01), Loh
patent: 2004/0056260 (2004-03-01), Slater, Jr. et al.
patent: 2004/0106234 (2004-06-01), Sorg et al.
patent: 2005/0002168 (2005-01-01), Narhi et al.
patent: 2005/0265404 (2005-12-01), Ashdown
patent: 2006/0001046 (2006-01-01), Batres et al.
patent: 2006/0157721 (2006-07-01), Tran et al.
patent: 2007/0096131 (2007-05-01), Chandra
patent: 2008/0006815 (2008-01-01), Wang et al.
patent: 1059678 (2000-12-01), None
patent: 1138747 (2001-10-01), None
patent: 1198016 (2002-04-01), None
patent: 1367655 (2003-12-01), None
patent: 1385215 (2004-01-01), None
patent: 1724848 (2006-11-01), None
patent: 1724848 (2006-11-01), None
patent: 2704690 (1994-11-01), None
patent: 2704690 (1994-11-01), None
patent: 2000002802 (2000-01-01), None
patent: 2000208820 (2000-07-01), None
patent: 2002009097 (2002-01-01), None
patent: 2005298817 (2005-10-01), None
patent: 2006054209 (2006-02-01), None
patent: WO0124283 (2001-04-01), None
patent: WO0124283 (2001-04-01), None
patent: WO03021691 (2003-03-01), None
patent: WO2005101909 (2005-10-01), None
patent: WO2006033695 (2006-03-01), None
patent: WO2006036251 (2006-04-01), None
patent: WO2007018560 (2007-02-01), None
Office Action from European Associate Feb. 27, 2008.
International Materials Reviews, “Materials for Field Emission Displays”, A. P. Burden 2001, vol. 46., pp. 1-62.
Nichia Corp White Led Part No. NSPW300BS, Specification for Nichia White Led, Model NSPW300BS Jan. 14, 2004.
Nichia Corp. White Led Part No. NSPW312BS, Specification for Nichia White Led, Model NSPW312BS Jan. 14, 2004.
Lau, John, “Flip-Chip Technologies”, McGraw Hill, 1996.
NPO-30394 Electrophoretic Deposition for Fabricating Microbatteries p. 1-2, NASA Tech Briefs Issue May 3, 2003.
PCT Search Report and Written Opinion Oct. 31, 2007.
PCT International Search Report and Written Opinion, PCT/US2007/024366,Date: Jul. 15, 2008.
Office Action re related U.S. Appl. No. 10/666,399, filed Sep. 5, 2008.
First Office Action for Chinese Patent Application No. 200580031382.3, Date: Jul. 18, 2008 Publication No. JP 2002-50799A, Date Feb. 15, 2002.
International Search Report for PCT/US2007/024367, Dated: Oct. 22, 2008.
Official Notice of Rejection re related Japanese Patent Application No. 2007-533459, Dated: Jul. 29, 2008.
Patent Abstracts of Japan, Pub. No. 2001-181613,Date: Jul. 3, 2001.
Patent Abstracts of Japan, Pub. No. 11-040858, Date: Feb. 12, 1999.
Patent Abstracts of Japan, Pub. No. 2004-221185, Date: Aug. 5, 2004.
Official Notice of Final Decision of Rejection re: related Japanese Patent Application No. 2007-533459, dated: Dec. 26, 2008.
Rejection Decision re: related Chinese Patent Application No. 200580031382.3, dated Feb. 2, 2009.
Communication pursuant to Article 94 (3) EPC re: related European Application No. 05808825.3, dated: Feb. 18, 2009.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of coating semiconductor light emitting elements by... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of coating semiconductor light emitting elements by..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of coating semiconductor light emitting elements by... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4131468

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.