Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-04-17
2007-04-17
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S613000, C257S738000, C257S778000, C257S780000, C257SE23020, C228S180210, C228S180220
Reexamination Certificate
active
11171483
ABSTRACT:
A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.
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Beyne Eric
Brebels Steven
De Raedt Walter
Sanders Steven
Torfs Tom
Chambliss Alonzo
Interuniversitair Microelektronica Centrum (IMEC)
Knobbe Martens Olson & Bear LLP
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