Methods of bonding targets to backing plate members using solder

Details Methods of bonding targets to backing plate members using solder Methods of bonding targets to backing plate members using solder

1994-11-15

1997-01-14

Bradley, P. Austin

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

22826272, 420555, 420577, 20429812, B23K 3102

Patent

active

055930824

ABSTRACT:
Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are available wherein a solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a low melting point metal component having a melting point of about 70.degree. C. or less and a finely divided solid solution component comprising at least one metal from groups IB, VIII, and IVB of the periodic chart and at least one metal from groups IVA, IIIA and VA of the periodic chart. The solder paste is applied to the surfaces to be soldered and is allowed to solidify. A durable solder bond is formed that is capable of withstanding high temperatures on the order of about 500.degree. C. without failure.

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