Methods of bonding superabrasive particles in an organic matrix

Details Methods of bonding superabrasive particles in an organic matrix Methods of bonding superabrasive particles in an organic matrix

2011-03-08

2011-03-08

Rachuba, Maurina (Department: 3727)

Abrading

Abrading process

With tool treating or forming

C451S443000

Reexamination Certificate

active

07901272

ABSTRACT:
Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle.

REFERENCES:
patent: 3743489 (1973-07-01), Wentorf, Jr. et al.
patent: 3767371 (1973-10-01), Wentorf et al.
patent: 3852078 (1974-12-01), Wakatsuki et al.
patent: 4078906 (1978-03-01), Green
patent: 4481016 (1984-11-01), Campbell et al.
patent: 4662896 (1987-05-01), Dennis
patent: 4849602 (1989-07-01), Gardner
patent: 4923490 (1990-05-01), Johnson et al.
patent: 4925457 (1990-05-01), deKok et al.
patent: 4954139 (1990-09-01), Ceruttl
patent: 5049165 (1991-09-01), Tselesin
patent: 5137543 (1992-08-01), Heath et al.
patent: 5190568 (1993-03-01), Tselesin
patent: 5195403 (1993-03-01), Sani et al.
patent: 5195404 (1993-03-01), Notter et al.
patent: 5232320 (1993-08-01), Tank et al.
patent: 5247765 (1993-09-01), Quintana
patent: 5374293 (1994-12-01), Takashita et al.
patent: 5380390 (1995-01-01), Tselesin
patent: 5453106 (1995-09-01), Roberts
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5505272 (1996-04-01), Clark
patent: 5527424 (1996-06-01), Mullins
patent: 5536202 (1996-07-01), Appel et al.
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5560745 (1996-10-01), Roberts
patent: 5560754 (1996-10-01), Johnson et al.
patent: 5851138 (1998-12-01), Hempel, Jr.
patent: 5921856 (1999-07-01), Zimmer
patent: 5924917 (1999-07-01), Benedict et al.
patent: 5975988 (1999-11-01), Christianson
patent: 6001008 (1999-12-01), Fujimora et al.
patent: 6027659 (2000-02-01), Billet
patent: 6054183 (2000-04-01), Zimmer et al.
patent: 6093280 (2000-07-01), Kirchner et al.
patent: 6190240 (2001-02-01), Kinoshita et al.
patent: 6213856 (2001-04-01), Cho et al.
patent: 6217413 (2001-04-01), Christianson
patent: 6224469 (2001-05-01), Ohmori et al.
patent: 6281129 (2001-08-01), Easter et al.
patent: 6293854 (2001-09-01), Kimura et al.
patent: 6299508 (2001-10-01), Gagliardi et al.
patent: 6319108 (2001-11-01), Adefris et al.
patent: 6346202 (2002-02-01), Molnar
patent: 6354918 (2002-03-01), Togawa et al.
patent: 6368198 (2002-04-01), Sung et al.
patent: 6371838 (2002-04-01), Holzapfel
patent: 6371842 (2002-04-01), Romero
patent: 6439986 (2002-08-01), Myoung et al.
patent: 6446740 (2002-09-01), Eyre
patent: 6478831 (2002-11-01), Tselesin
patent: 6626167 (2003-09-01), Kim et al.
patent: 6672943 (2004-01-01), Vogtmann et al.
patent: 6694847 (2004-02-01), Hiroyasu et al.
patent: 6755720 (2004-06-01), Ishizaki et al.
patent: 6790126 (2004-09-01), Wood et al.
patent: 6818029 (2004-11-01), Myoung et al.
patent: 6824455 (2004-11-01), Osterheld et al.
patent: 6884155 (2005-04-01), Sung et al.
patent: 6945857 (2005-09-01), Doan et al.
patent: 7021995 (2006-04-01), Toge et al.
patent: 7033408 (2006-04-01), Fries et al.
patent: 7044990 (2006-05-01), Ishizaki et al.
patent: 7066795 (2006-06-01), Balagani et al.
patent: 7201645 (2007-04-01), Sung
patent: 7258708 (2007-08-01), Sung
patent: 7261621 (2007-08-01), Moon et al.
patent: 7465217 (2008-12-01), Kinoshita et al.
patent: 7651386 (2010-01-01), Sung
patent: 7658666 (2010-02-01), Sung
patent: 2001/0009844 (2001-07-01), Cho et al.
patent: 2002/0042200 (2002-04-01), Fawcett
patent: 2002/0127962 (2002-09-01), Cho et al.
patent: 2002/0173234 (2002-11-01), Sung et al.
patent: 2003/0084894 (2003-05-01), Sung
patent: 2003/0114094 (2003-06-01), Myoung et al.
patent: 2003/0207659 (2003-11-01), Annen et al.
patent: 2005/0060941 (2005-03-01), Provow et al.
patent: 2005/0118939 (2005-06-01), Duescher
patent: 2005/0260939 (2005-11-01), Andrews et al.
patent: 2006/0079160 (2006-04-01), Balagani et al.
patent: 2006/0143991 (2006-07-01), Sung
patent: 2006/0254154 (2006-11-01), Huang et al.
patent: 2006/0258276 (2006-11-01), Sung
patent: 2007/0051355 (2007-03-01), Sung
patent: 2007/0060026 (2007-03-01), Sung
patent: 2007/0066194 (2007-03-01), Wielonski et al.
patent: 2007/0155298 (2007-07-01), Sung
patent: 2007/0249270 (2007-10-01), Sung
patent: 2007/0264918 (2007-11-01), Sung
patent: 2008/0096479 (2008-04-01), Sung
patent: 2008/0171503 (2008-07-01), Sung
patent: WO 02/31078 (2002-04-01), None
patent: WO 2004/094106 (2004-11-01), None
patent: WO 2007-032946 (2007-03-01), None
U.S. Appl. No. 11/223,786, filed Sep. 9, 2005, Chien-Min Sung. Office action issued Jan. 7, 2010.
U.S. Appl. No. 11/223,786, filed Sep. 9, 2005, Chien-Min Sung. Office Action issued May 12, 2010.
U.S. Appl. No. 11/357,713, filed Feb. 17, 2006, Chien-Min Sung. Office action issued Jan. 14, 2010.
Syndite, elementsix advancing diamond, CTM 302, 2 pages.
U.S. Appl. No. 12/716,734 filed Mar. 3, 2010, Chien-Min Sung, Office Action issued Sep. 10, 2010.
U.S. Appl. No. 11/223,786 filed Sep. 9, 2005, Chien-Min Sung, Office Action issued Aug. 31, 2010.

Affiliated with

Also associated with

Rating

Methods of bonding superabrasive particles in an organic matrix does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of bonding superabrasive particles in an organic matrix, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of bonding superabrasive particles in an organic matrix will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2653516