Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-06-06
2006-06-06
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S290000, C156S308200, C156S308400
Reexamination Certificate
active
07056404
ABSTRACT:
Methods of and apparatus for bonding and/or embossing of materials, especially materials used in the manufacture of hygienic articles, including, but not limited, to absorbent articles such as feminine hygiene articles, disposable diapers, incontinence devices, wipes, and the like.
REFERENCES:
patent: 4075382 (1978-02-01), Chapman
patent: 4196562 (1980-04-01), Hirschman
patent: 4240416 (1980-12-01), Boich
patent: 4473611 (1984-09-01), Haq
patent: 4854984 (1989-08-01), Ball
patent: 5269983 (1993-12-01), Schulz
patent: 5451452 (1995-09-01), Phan
patent: 5928452 (1999-07-01), McFall
patent: 6173496 (2001-01-01), Makoui
patent: 6183587 (2001-02-01), McFall
patent: 6475346 (2002-11-01), Lefebvre Du Grosriez
patent: 0 374 910 (1990-06-01), None
patent: 0 374 910 (1993-07-01), None
patent: 0 622 064 (1994-11-01), None
patent: WO 95/13774 (1995-05-01), None
patent: WO 96/21682 (1996-07-01), None
patent: WO-99/26769 (1999-06-01), None
patent: WO 02/070243 (2002-09-01), None
PCT International Search Report dated Jun. 1, 1999.
PCT International Search Report dated Oct. 29, 2004.
DeHaan Dennis Allen
McFall Ronald Ray
Aftergut Jeff H.
Kolodesh Michael S.
Oehlenschlager James E.
The Procter & Gamble & Company
Weirich David M.
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