Methods of biasing a multi-level-cell memory

Static information storage and retrieval – Floating gate – Multiple values

Reexamination Certificate

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C365S185180

Reexamination Certificate

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07548458

ABSTRACT:
Methods are described for double-side-bias of multi-level-cell memory devices comprising a NAND array that comprises a plurality of charge trapping memory cells. A memory device is programmed by a double-side-bias electron injection technique and is erased by a double-side-bias hole injection technique. Each charge trapping memory cell includes 2nlogic states, such as four binary logic states of a logic 00 state, a logic 01 state, a logic 10 state and a logic 11 state. The memory device can be programmed by a double-side-bias multi-level-cell program method either with a variable DSB (Vd/Vs) voltage or with a variable gate bias voltage Vg.

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Yeh, C.C., et al., “PHINES: A Novel Low Power Program/Erase, Small Pitch, 2-Bit per Cell Flash Memory,” IEDM Tech. Dig. 2002, 931-934.
Ito et al., “A Novel MNOS Techology Using Gate Hole Injection in Erase Operation for Embedded Nonvolatile Memory Applications,” 2004 Symp. on VLSI Tech Digest of Tech Papers 2004, 80-81.

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