Methods of assembling interconnect members with printed circuit

Metal working – Method of mechanical manufacture – Electrical device making

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29837, H05K 330

Patent

active

042479819

ABSTRACT:
Interconnect sockets (10) are assembled with substrates, such as printed circuit cards (12), to connect the leads (17) of electrical components (18) to conductive pads (14) deposited on the substrate. Each socket has an end section (19)inserted into a mounting hole (11) in the substrate, for gripping portions of the walls of the hole to mount the socket to the board; a midsection (13) for contacting the conductive pad; and a lead-engaging section (16) for gripping the component lead and connecting it to the pad through the socket. Preferably, the socket is a tubular member of a conductively plated spring metal, with spring members (20, 22, 30) for resiliently engaging the walls of the hole, the contact pad, and the lead. The sockets are especially useful with thermosetting conductive-particle/resin conductors, such as silver-epoxy or -acrylic resin "thick-film " conductive inks.
This divisional application relates particularly to methods of assembling such sockets with printed circuits having flowable, heat-curable conductive pads (14), wherein each socket is first fastened in the mounting hole so that a contact section (13) of the socket compresses the pad, after which the pad is heated to cure the conductive patterns and to bond the contact section of the socket to the pad.

REFERENCES:
patent: 3120418 (1964-02-01), Deakin
patent: 3187298 (1965-06-01), Shannon
patent: 3202755 (1965-08-01), Oswald
patent: 3573707 (1971-04-01), Reynolds
patent: 3681738 (1972-08-01), Friend
patent: 3710196 (1973-01-01), Fifield
patent: 3971610 (1976-07-01), Buchoff
patent: 3975072 (1976-08-01), Ammon
patent: 3992076 (1976-11-01), Gluntz
patent: 4024629 (1977-05-01), LeMoine et al.
patent: 4050772 (1977-09-01), Birnholz et al.
1969-1970, Modern Plastics Encyclopedia, pp. 968-969, 972-973 and p. 984, McGraw Hill Inc. (1969).

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