Methods of and devices for determining the soldering capability

Details Methods of and devices for determining the soldering capability Methods of and devices for determining the soldering capability

1983-04-28

1985-07-16

Ramsey, Kenneth J.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

73 644, 73432R, 228 565, 2281801, G01N 1300

Patent

active

045291160

ABSTRACT:
First and second transparent metallized gauge plates (52 and 52') of solder-nonwettable, heat-resistant material, such as glass or quartz, each have a solder wave test pattern in the form of spaced parallel metal strips (56 and 56') formed thereon. The metal strips (56) on the first gauge plate (52) are of progressively increasing widths, with a narrowest strip located adjacent one edge of the plate and a widest strip located adjacent an opposite edge of the plate. The metal strips 56' on the second gauge plate (52') are of uniform widths. The first gauge plate (52) is engaged with a solder wave (34) to measure the activation level of a soldering flux (44) being introduced into the solder wave, and thereby to determine the capability of the solder wave to produce properly soldered printed circuit board assemblies (10). The second gauge plate is engaged with the solder wave (34) to measure and/or adjust other flow characteristics of the solder wave, such as a width of solder wave impingement (80 ) on the printed circuit board assemblies (10).

REFERENCES:
patent: 1804508 (1931-05-01), Nicholson
patent: 2993815 (1961-07-01), Treptow
patent: 3118788 (1964-01-01), Hensler
patent: 3732792 (1973-05-01), Tarnopol et al.
patent: 3857290 (1974-12-01), Aitken et al.
patent: 4180199 (1979-12-01), O'Rourke et al.
patent: 4227415 (1980-10-01), Spirig
patent: 4467638 (1984-08-01), Greenstein

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