Methods of and device for encapsulation and termination of...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S065000, C438S069000, C438S051000, C438S055000, C429S305000, C429S306000, C429S310000, C429S311000

Reexamination Certificate

active

06916679

ABSTRACT:
A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.

REFERENCES:
patent: 4127424 (1978-11-01), Ullery, Jr.
patent: 4481265 (1984-11-01), Ezawa et al.
patent: 4555456 (1985-11-01), Kanehori et al.
patent: 4740431 (1988-04-01), Little
patent: 5110696 (1992-05-01), Shokoohi et al.
patent: 5171413 (1992-12-01), Arntz et al.
patent: 5338625 (1994-08-01), Bates et al.
patent: 5411592 (1995-05-01), Ovshinsky et al.
patent: 5445906 (1995-08-01), Hobson et al.
patent: 5470396 (1995-11-01), Mongon et al.
patent: 5512147 (1996-04-01), Bates et al.
patent: 5512389 (1996-04-01), Dasgupta et al.
patent: 5552242 (1996-09-01), Ovshinsky et al.
patent: 5561004 (1996-10-01), Bates et al.
patent: 5567210 (1996-10-01), Bates et al.
patent: 5599355 (1997-02-01), Nagasubramanian et al.
patent: 5645960 (1997-07-01), Scrosati et al.
patent: 5705293 (1998-01-01), Hobson
patent: 5755940 (1998-05-01), Shindo
patent: 5834137 (1998-11-01), Zhang et al.
patent: 5895731 (1999-04-01), Clingempeel
patent: 5961672 (1999-10-01), Skotheim et al.
patent: 6030421 (2000-02-01), Gauthier et al.
patent: 6045942 (2000-04-01), Miekka et al.
patent: 6080508 (2000-06-01), Dasgupta et al.
patent: 6120890 (2000-09-01), Chen et al.
patent: 6168884 (2001-01-01), Neudecker et al.
patent: 6175075 (2001-01-01), Shiotsuka et al.
patent: 6218049 (2001-04-01), Bates et al.
patent: 6242129 (2001-06-01), Johnson
patent: 6280875 (2001-08-01), Kwak et al.
patent: 6323416 (2001-11-01), Komori et al.
patent: 6369316 (2002-04-01), Plessing et al.
patent: 6376027 (2002-04-01), Lee et al.
patent: 6380477 (2002-04-01), Curtin
patent: 6413285 (2002-07-01), Chu et al.
patent: 6664006 (2003-12-01), Munshi
patent: 2001/0054437 (2001-12-01), Komori et al.
patent: 2003/0029493 (2003-02-01), Plessing
patent: 2003/0091904 (2003-05-01), Munshi
patent: 2003/0109903 (2003-06-01), Berrang et al.
patent: 60068558 (1985-04-01), None
patent: WO 98/47196 (1998-10-01), None
patent: WO 00/60682 (2000-10-01), None
patent: WO 01/17052 (2001-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of and device for encapsulation and termination of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of and device for encapsulation and termination of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of and device for encapsulation and termination of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3369098

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.