Classifying – separating – and assorting solids – Adhesion – Coated surface or mass
Patent
1976-12-15
1978-04-18
Knowles, Allen N.
Classifying, separating, and assorting solids
Adhesion
Coated surface or mass
209122, B07C 700
Patent
active
040850382
ABSTRACT:
A wafer is mounted upon a substrate and separated into individual chips which are retained on the substrate. The separated wafer and substrate are then placed on a demounting device with a passageway such that the chips on a first portion of the wafer lie over the passageway while chips on a second portion of the wafer do not. When the separated wafer is subsequently subjected to a demounting force, the chips will demount from the substrate with the chips on the first portion falling into a catch bin located in the passageway while chips on the second portion are discarded. Additional demounting devices can be provided within the passageway, if further sorting of the chips on the first portion of the separated wafer is desired.
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Hoofnagle J. B.
Knowles Allen N.
Montone G. E.
Western Electric Co. Inc.
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