Chemistry: electrical and wave energy – Processes and products
Patent
1979-04-18
1980-09-23
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204 28, 204206, 204224R, C25D 502, C25D 508, C25D 706
Patent
active
042241170
ABSTRACT:
Selected, relatively inaccessible, areas of surfaces (28) which define openings (21) that extend through a strip, which is being advanced at a relatively high velocity along a path through a closed plating cell, are electroplated with a minimum required thickness of metal. The strip (11) is cathodically charged and is masked along a portion of a path to expose at least the surfaces which define the openings. A flow passage for an electroplating electrolyte (41) is established from a source (42) past a charged anode (101) in a direction through the openings (21) and includes a linear portion extending substantially normal to the strip on each side thereof. The anode extends along the portion of the path, parallel to and spaced from the strip (11), and focused on the areas to be plated. The charged anode (101) and the exposed areas of surfaces of the strip (11) are contacted with the electrolyte (41) to charge the electrolyte and pass an electric current therethrough to plate the exposed areas of the surfaces.
REFERENCES:
patent: 2974097 (1961-03-01), Ramirez et al.
patent: 3470081 (1969-09-01), Lovekin
patent: 3644181 (1972-02-01), Donaldson
patent: 3723283 (1973-03-01), Johnson
patent: 3788963 (1974-01-01), Kosowsky
patent: 3894918 (1975-07-01), Corby
patent: 3962063 (1976-06-01), Hingorany
patent: 3963569 (1976-06-01), Toledo
patent: 4029555 (1977-06-01), Tezuka
patent: 4030999 (1977-06-01), Allen
patent: 4033832 (1977-07-01), Sterling
patent: 4033833 (1977-07-01), Bestel
patent: 4048043 (1977-09-01), Bick
patent: 4069126 (1978-01-01), Abei
Edwards Monty J.
Voytko James E.
Hoofnagle, Jr. J. B.
Somers E. W.
Tufariello T. M.
Western Electric Company Inc.
LandOfFree
Methods of and apparatus for selective plating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of and apparatus for selective plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of and apparatus for selective plating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-643196