Methods of and apparatus for selective plating

Chemistry: electrical and wave energy – Processes and products

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204 28, 204206, 204224R, C25D 502, C25D 508, C25D 706

Patent

active

042241170

ABSTRACT:
Selected, relatively inaccessible, areas of surfaces (28) which define openings (21) that extend through a strip, which is being advanced at a relatively high velocity along a path through a closed plating cell, are electroplated with a minimum required thickness of metal. The strip (11) is cathodically charged and is masked along a portion of a path to expose at least the surfaces which define the openings. A flow passage for an electroplating electrolyte (41) is established from a source (42) past a charged anode (101) in a direction through the openings (21) and includes a linear portion extending substantially normal to the strip on each side thereof. The anode extends along the portion of the path, parallel to and spaced from the strip (11), and focused on the areas to be plated. The charged anode (101) and the exposed areas of surfaces of the strip (11) are contacted with the electrolyte (41) to charge the electrolyte and pass an electric current therethrough to plate the exposed areas of the surfaces.

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