Methods of and apparatus for producing a stress-free laminate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156222, 156282, 156309, 156461, 561498, B32B 3106, B32B 3114

Patent

active

039679977

ABSTRACT:
Tandem operations for manufacturing coaxial cable units include new and unobvious methods and apparatus for laminating an outer conductor, for drawing an inner conductor, for applying plastic discs to the inner conductor and for corrugating the outer conductor. Laminating the outer conductor is accomplished by passing a copper, copolymer adhesive, steel sandwich through three pairs of heated rolls. The heated laminate is passed over a roller designed to impart a three-dimensional curvature to the laminate. Then, the laminate is advanced in the manufacturing atmosphere and over another roller to remove the three dimensional curvature while the heat is removed. This produces a laminate which is essentially stress-free although composed of dissimilar materials. The inner conductor is drawn to a final diameter by an ultrasonically vibrating drawing die within a liquid medium which acts as a lubricant and as a cleaner to form a clean, smooth inner conductor. The drawn inner conductor is threaded through a disc applicator where polyethylene discs punched from strips of material are attached to the inner conductor by cooperatively arranged punching and injection facilities. The laminate passes to a pair of dancer-controlled pull rolls designed to feed the laminate to the corrugator with no back tension. The laminate is corrugated with a special profile to provide required material take-up, flexibility, and hoop strength and so that the overlap side nests with the opposite side. The corrugated laminate and the disc-insulated inner conductor are then fed into a tube forming machine where the corrugated laminate is wrapped around the disc-insulated inner conductor with an overlap seam that is soldered or otherwise joined.

REFERENCES:
patent: 775541 (1904-11-01), McConnell
patent: 2860409 (1958-11-01), Boessenkool et al.
patent: 2944586 (1960-07-01), Yanulis
patent: 3001901 (1961-09-01), Barkley
patent: 3037868 (1962-06-01), Rosser
patent: 3094453 (1963-06-01), Scherer
patent: 3127304 (1964-03-01), Borup
patent: 3228103 (1966-01-01), Shewmon
patent: 3402086 (1968-09-01), Smith et al.
patent: 3620898 (1971-11-01), Harris et al.
patent: 3725169 (1973-04-01), Allen et al.
patent: 3736203 (1973-05-01), Miura

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of and apparatus for producing a stress-free laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of and apparatus for producing a stress-free laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of and apparatus for producing a stress-free laminate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1531839

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.