Methods of and apparatus for mounting articles to a carrier memb

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156297, 156552, 156578, B29C 1700, B32B 3100, B65C 1104

Patent

active

040295362

ABSTRACT:
An apparatus aligns small articles, such as semiconductor chips, to a reference axis and loads them on predetermined sites of a carrier, such as a tape. The loading requires precisely positioning adhesive dots and the articles at the sites of the tape. Precision within desired limits is achieved by aligning both an applicator for applying the adhesive and the articles in sequence to a common centerline. The tape is maintained in contact with two diametrically opposed locations of an index wheel located on the common centerline. The index wheel is then reciprocated along the centerline to alternately apply adhesive to one of the sites on the tape and then load the aligned article to another one of the sites. An additional article is aligned to the centerline each time loading is completed of a previously aligned article to its respective site. The aligning facility is operated by a cam which controls the vertical position of a plunger and acts as a valving means for selective vacuum and air purge applications.

REFERENCES:
patent: 3743558 (1973-07-01), Ludwig
patent: 3785903 (1974-01-01), Boyer et al.
patent: 3834966 (1974-09-01), Kelly
patent: 3855034 (1974-12-01), Miller
patent: 3871936 (1975-03-01), Boyer et al.
patent: 3982979 (1976-09-01), Hentz

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