Methods of and apparatus for immobilizing semiconductor wafers d

Details Methods of and apparatus for immobilizing semiconductor wafers d Methods of and apparatus for immobilizing semiconductor wafers d

1995-05-31

1997-04-08

Breneman, R. Bruce

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

83 84, H01L 21302

Patent

active

056187599

ABSTRACT:
A method of immobilizing both (i) a semiconductor wafer (16) during the sawing thereof to form individual chips (18) and (ii) the resulting chips (18) as and after sawing of the wafer (16) is completed. A negative pressure is applied to the wafer (16) through a wafer carrier (12) to immobilize the wafer and individual chips. The negative pressure is applied to the wafer via ports (30) in alignment with the location of each chip (18) to be formed. A grid (40) or negative pressure is used to restrain the chips as they are subsequently transported following sawing.

REFERENCES:
patent: 4261781 (1981-04-01), Edmonds
patent: 5489555 (1996-02-01), Yamazaki
patent: 5543365 (1996-08-01), Wills et al.

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