Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1974-11-27
1976-03-30
Smith, Al Lawrence
Metal fusion bonding
Process
With condition responsive, program, or timing control
228105, 228180A, 228 6A, 228 49, 29626, H05K 330, H01L 2158
Patent
active
039469310
ABSTRACT:
A bonder for attaching in succession small articles such as electronic devices to substrates has eight stations located along the path of a rotary member. The rotary member supports eight holders for substrates which are moved in sequence from station to station. At a first station a substrate is loaded onto one of the holders. The holder is then moved to an alignment station and transferred from the support member to a planar manipulator. An optical alignment control system recognizes a position of the substrate on the holder and controls the manipulation of the holder to align a substrate to a predetermined reference axis. The holder is then transferred back to the support member to fix the position of the substrate with respect to the support member. At the next station an article is also aligned to a corresponding reference axis and then tack-bonded or preliminarily attached to a bond site on the substrate. The article is then permanently bonded and the substrate with the bonded article is unloaded at an unload station. Prior to the completion of the cycle, the substrate holder is recentered to a starting position to prevent cumulative movement of the substrate holder with respect to the support member.
REFERENCES:
patent: 3361891 (1968-01-01), Whitefield
patent: 3379357 (1968-04-01), Chagon et al.
patent: 3475805 (1969-11-01), Rottmann
patent: 3581375 (1971-06-01), Rottmann
patent: 3696985 (1972-10-01), Herring et al.
patent: 3776394 (1973-12-01), Miller
patent: 3785507 (1974-01-01), Wiesler et al.
patent: 3793710 (1974-02-01), Monahan et al.
patent: 3838274 (1974-09-01), Doubek, Jr. et al.
patent: 3861019 (1975-01-01), Choate et al.
Bahnck Norman
Booth Raymond H.
Boyer John A.
Monahan Jack J.
Ramsey K. J.
Schellin W. O.
Smith Al Lawrence
Western Electric Company Inc.
LandOfFree
Methods of and apparatus for bonding an article to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of and apparatus for bonding an article to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of and apparatus for bonding an article to a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-516272