Metal working – Method of mechanical manufacture – Electrical device making
Patent
1983-04-11
1985-03-19
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
29840, 228255, 2281802, H05K 300
Patent
active
045050350
ABSTRACT:
A circuit board connector (14) is assembled to a printed wiring board (11) by first aligning a plurality of leads (18) by urging them into spaced guide grooves (49) of a workholder (41). The spacing of the guide grooves (49) corresponds to the spacing of terminals, also referred to as solder lands (19) on the printed wiring board (11). Within the guide grooves (49) the leads (18) are retained against a possible, lateral resilient stress while a deformable material, such as a solder, is formed across the leads and into spaces between the leads (18). The solder temporarily retains the spacing between the leads while the leads are removed from the workholder and become aligned with the lands (19). During the assembly of the connector (14) to the printed wiring board (11), the leads become resiliently deflected perpendicularly to the plane of the printed wiring board (11). The deflection generates a resilient force which frictionally urges the leads and the lands into contact with each other. The friction contact maintains the aligned position of the leads against any remaining lateral stresses within the leads (18) while the spacing solder is melted, reflows and solidifies to permanently bond the aligned leads (18) to the lands (19).
REFERENCES:
patent: 1399769 (1921-12-01), Hodgkinson
patent: 3184699 (1965-05-01), Spera
patent: 3657789 (1972-04-01), Anglade
patent: 3750252 (1973-08-01), Landman
patent: 3750265 (1973-08-01), Cushman
patent: 3886650 (1975-06-01), Cobaugh et al.
patent: 3913818 (1975-10-01), Osipov et al.
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4399610 (1983-08-01), Moyer
Western Electric Tech Digest, No. 62, Apr. 1981, p. 9, Connectors and Printed Wiring Boards by D. T. L. Pari et al.
Burton William H.
Snow William E.
Arbes Carl J.
AT&T - Technologies, Inc.
Bell Telephone Laboratories Inc.
Goldberg Howard N.
Schellin W. O.
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