Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2005-08-30
2010-10-05
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S116000, C438S118000, C438S126000, C438S127000, C438S464000, C257S686000, C257S777000, C257S778000, C257S787000, C257SE25013, C257SE25027, C257SE23124, C257SE23129, C257SE21603, C257SE21700
Reexamination Certificate
active
07807505
ABSTRACT:
Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods are disclosed herein. A method for packaging microfeature devices in accordance with an embodiment of the invention can include releasably attaching a plurality of first known good microelectronic dies to a carrier substrate in a desired arrangement. In several embodiments, for example, the first dies can be releasably attached to an attachment feature on the carrier substrate. The method can also include attaching one or more second known good microelectronic dies to the individual first dies in a stacked configuration to form a plurality of stacked devices. The method further includes at least partially encapsulating the stacked devices and separating the stacked devices from each other.
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Farnworth Warren M.
Wood Alan G.
Ho Hoang-Quan T
Huynh Andy
Micro)n Technology, Inc.
Perkins Coie LLP
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