Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-08-14
2007-08-14
Crane, Sara (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
Reexamination Certificate
active
10687096
ABSTRACT:
Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices are disclosed herein. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one embodiment, the microelectronic workpiece further includes a plurality of dies formed on the device side of the substrate, a dielectric layer over the dies, and a plurality of bond-pads on the dielectric layer. The dies have integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry. The ball-pads are arranged in ball-pad arrays over corresponding dies on the substrate. The microelectronic workpiece of this embodiment further includes a protective layer over the backside of the substrate. The protective layer is formed on the backside of the substrate from a material that is in a flowable state and is then cured to a non-flowable state.
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Crane Sara
Micro)n Technology, Inc.
Perkins Coie LLP
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