Methods for treating wafers on assembly carriers

Details Methods for treating wafers on assembly carriers Methods for treating wafers on assembly carriers

2011-04-05

2011-04-05

Eley, Timothy V (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C156S080000, C451S053000, C451S063000

Reexamination Certificate

active

07918714

ABSTRACT:
A method and a device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film.

REFERENCES:
patent: 2984897 (1961-05-01), Godfrey
patent: 5394707 (1995-03-01), Miller et al.
patent: 5791973 (1998-08-01), Nishio
patent: 6682990 (2004-01-01), Iwane et al.
patent: 6683332 (2004-01-01), Shinozaki et al.
patent: 2007/0221254 (2007-09-01), Izumi et al.
patent: 103 19 272 (2004-11-01), None
patent: 0 737 546 (1996-10-01), None
patent: 1 148 554 (2001-10-01), None
patent: 7-283293 (1995-10-01), None
patent: 8-64662 (1996-03-01), None
patent: 9-123059 (1997-05-01), None
patent: WO 03/003428 (2003-01-01), None
Tong, Q.-Y., et al., “Semiconductor Wafer Bonding,” 1999, pp. 1-6, John Wiley & Sons, Inc., Hoboken, NJ, USA.

Affiliated with

Also associated with

Rating

Methods for treating wafers on assembly carriers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for treating wafers on assembly carriers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for treating wafers on assembly carriers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2636414