Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1989-10-25
1990-07-03
Powell, William A.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
156643, 156646, 156655, 20419211, 20419234, 20429815, 427400, B05D 306, B05D 500, B44C 122, B29C 3700
Patent
active
049389920
ABSTRACT:
Thermal transfer between a semiconductor wafer and a platen during vacuum processing is provided through a soft, thermally-conductive polymer layer having a thin, hard surface film. The soft polymer layer, which is preferably silicone rubber containing thermally-conductive particles, conforms to surface irregularities on the wafer and has low thermal resistance. The surface film is preferably silicon dioxide in the form of a multiplicity of flat plates integrally formed on the silicone rubber. Adherence of the wafer and of foreign matter to the polymer layer is prevented by the surface film. In addition, the underlying polymer layer is protected by the surface film. A high purity polymer layer is fabricated by evacuating the mold cavity and the resin container prior to injection of resin. The mold for the polymer layer utilizes a hard, smooth mold release surface and a resilient gasket between the platen and the mold release surface. The gasket establishes the dimensions of the polymer layer and seals the mold cavity. The surface film is formed by oxygen plasma treatment of the silcone rubber layer.
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G. M. Greenstein et al., "Heat Sinking Wafer Gripper", IBM Technical Disclosure Bulletin, vol. 20, No. 3, 08/77.
Cole Stanley Z.
Fisher Gerald M.
Powell William A.
Varian Associates Inc.
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