Methods for the in-process detection of workpieces in a CMP envi

Details Methods for the in-process detection of workpieces in a CMP envi Methods for the in-process detection of workpieces in a CMP envi

1998-03-05

1999-11-30

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 6, 451 8, 451 41, B24B 4904

Patent

active

059932899

ABSTRACT:
A method for detecting the presence of a workpiece on a polishing pad of a chemical mechanical polishing (CMP) machine applies an optical interrogation signal to a workpiece during the CMP process. An optical probe assembly produces a light signal that communicates with the polishing pad; portions of the light signal reflect from the polishing pad in a scattered manner. A light receptor receives reflected light associated with the interrogation signal, and the characteristics of the received light are analyzed and processed by a suitable processor. By analyzing the scattered light signals, the method distinguishes the reflective characteristics of the polishing pad from the reflective characteristics of the workpiece. Thus, the method may be used to detect a lost or broken workpiece in a fast and effective manner.

REFERENCES:
patent: Re34425 (1993-11-01), Schultz
patent: 4805348 (1989-02-01), Arai et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5099614 (1992-03-01), Arai et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5433650 (1995-07-01), Winebarger
patent: 5483568 (1996-01-01), Yano et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5498196 (1996-03-01), Karlsrud et al.
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5499733 (1996-03-01), Litvak
patent: 5605760 (1997-02-01), Roberts
patent: 5643046 (1997-07-01), Katakabe et al.
patent: 5643050 (1997-07-01), Chen
patent: 5648849 (1997-07-01), Canteloup

Affiliated with

Also associated with

Rating

Methods for the in-process detection of workpieces in a CMP envi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for the in-process detection of workpieces in a CMP envi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for the in-process detection of workpieces in a CMP envi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1665055