Methods for the fabrication of microelectronic device...

Details Methods for the fabrication of microelectronic device... Methods for the fabrication of microelectronic device...

2009-12-23

2011-11-29

Pert, Evan (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S734000, C257SE21505, C361S748000, C174S262000

Reexamination Certificate

active

08067266

ABSTRACT:
The present disclosure relates to fabricating substrates for use in microelectronic device packages. In at least one embodiment, two substrate cores may be attached together during build-up layer formation on each substrate core to increase substrate fabrication throughput. The embodiments of the present disclosure may allow the processing of relatively thin substrates.

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