Methods for standardizing a test head assembly

Details Methods for standardizing a test head assembly Methods for standardizing a test head assembly

2007-10-23

2007-10-23

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S761010

Reexamination Certificate

active

10263491

ABSTRACT:
A standardized test head assembly for testing a plurality of integrated circuit dice each having a different bonding pad footprint, the test head assembly including an arrangement of probe holes defined by a predetermined configuration of contact positions, wherein the predetermined configuration defines each of the different bonding pad footprints so that during testing the probe holes align with a subset of the bonding pads for each of the different bonding pad footprints.

REFERENCES:
patent: 4609243 (1986-09-01), Wyss
patent: 4866375 (1989-09-01), Malloy
patent: 4954878 (1990-09-01), Fox et al.
patent: 5757201 (1998-05-01), Partridge et al.
patent: 5977787 (1999-11-01), Das et al.
patent: 6351133 (2002-02-01), Jones et al.
patent: 6639420 (2003-10-01), Chen et al.
patent: 6819127 (2004-11-01), Hembree

Affiliated with

Also associated with

Rating

Methods for standardizing a test head assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for standardizing a test head assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for standardizing a test head assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3903156