Methods for stacking wire-bonded integrated circuit dice on...

Details Methods for stacking wire-bonded integrated circuit dice on... Methods for stacking wire-bonded integrated circuit dice on...

2006-11-20

2008-09-09

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S678000, C257S723000

Reexamination Certificate

active

07423339

ABSTRACT:
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area on the surface of the base at least partially bounded by the wire-bondable pads. A first integrated circuit (IC) die is flip-chip bonded to the flip-chip pads, and a second IC die is back-side attached to the first IC die and then wire-bonded to the wire-bondable pads. As a result, the flip-chip mounted first IC die is stacked with the second IC die in a simple, novel manner.

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