Methods for removing metallic contamination from wafer...

Details Methods for removing metallic contamination from wafer... Methods for removing metallic contamination from wafer...

2005-03-22

2005-03-22

El-Arini, Zeinab (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S022100, C134S022180, C134S022190, C134S026000, C134S033000, C134S902000

Reexamination Certificate

active

06869486

ABSTRACT:
In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution. The chelating agent solution removes metallic contamination from the containers. The containers are then rinsed with a rinsing liquid, such as deionized water and a surfactant. The containers are then dried, preferably by applying heat and/or hot air movement.

REFERENCES:
patent: 4027686 (1977-06-01), Shortes et al.
patent: 5705089 (1998-01-01), Sugihara et al.
patent: 5738128 (1998-04-01), Thompson et al.
patent: 5863348 (1999-01-01), Smith, Jr. et al.
patent: 6413878 (2002-07-01), Woolsey et al.
patent: 6432214 (2002-08-01), Bryer et al.
patent: 6703319 (2004-03-01), Yates et al.
patent: 20020102852 (2002-08-01), Verhaverbeke et al.

Affiliated with

Also associated with

Rating

Methods for removing metallic contamination from wafer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for removing metallic contamination from wafer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for removing metallic contamination from wafer... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3424257