Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-01-30
2007-01-30
Mayes, Melvin (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S230000, C156S272200, C156S275700, C438S113000, C438S118000, C438S458000, C438S460000, C438S464000
Reexamination Certificate
active
11185045
ABSTRACT:
Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece. The separation process removes at least approximately all the adhesive material from the non-active portion of the workpiece.
REFERENCES:
patent: 4353952 (1982-10-01), Brown et al.
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5888883 (1999-03-01), Sasaki et al.
patent: 6204079 (2001-03-01), Aspar et al.
patent: 6214733 (2001-04-01), Sickmiller
patent: 6232136 (2001-05-01), Zavracky et al.
patent: 6358354 (2002-03-01), Patil
patent: 6558975 (2003-05-01), Sugino et al.
patent: 6642126 (2003-11-01), Igel
patent: 6896760 (2005-05-01), Connell et al.
patent: 7022418 (2006-04-01), Connell et al.
patent: 7037751 (2006-05-01), Connell et al.
patent: 1041624 (2000-10-01), None
U.S. Appl. No. 11/385,356, filed Mar. 21, 2006, Connell et al.
U.S. Appl. No. 11/386,208, filed Mar. 22, 2006, Connell et al.
U.S. Appl. No. 11/374,750, filed Mar. 14, 2006, Pratt et al.
Sumitomo 3M Ltd., Product Description, H-WSS (Wafer Support System) For Ultra Thin Wafer Backgrinding, 2 pages, Sep. 1, 2003.
Kirby Kyle K.
Oliver Steven D.
Mayes Melvin
Mazumdar Sonya
Micro)n Technology, Inc.
Perkins Coie LLP
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