Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-08-17
2010-12-07
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S113000, C438S459000, C438S464000, C438S465000, C438S977000, C257SE23194
Reexamination Certificate
active
07846776
ABSTRACT:
Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods are disclosed herein. One embodiment, for example, is directed to a method for processing a microfeature workpiece releasably attached to a first support member. The workpiece includes a microelectronic substrate, a plurality of microelectronic dies on and/or in the substrate, and a sacrificial support member attached to an active side of the substrate. The method can include separating individual dies from the workpiece by cutting through the sacrificial support member and the substrate while the workpiece is attached to the first support member. The method can also include attaching a singulated die and corresponding portion of the sacrificial support member as a unit to a second support member. The method can further include removing the sacrificial support member from the die attached to the second support member with a removal solution that attacks a material of which the sacrificial support member is composed.
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Ball Michael B.
Polinsky William A.
Micro)n Technology, Inc.
Nguyen Ha Tran T
Perkins Coie LLP
Whalen Daniel
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