Methods for providing an integrated circuit package with an...

Details Methods for providing an integrated circuit package with an... Methods for providing an integrated circuit package with an...

2005-03-29

2005-03-29

Thai, Luan (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S401000, C438S613000, C438S108000, C438S612000

Reexamination Certificate

active

06872592

ABSTRACT:
An integrated circuit package is provided with an alignment mechanism by 1) heating a wetting media that has been applied to a number of annular ring shaped alignment pads provided on the integrated circuit package, at known locations with respect to a pattern of contacts pads that is provided on the integrated circuit package, and then 2) while the wetting media is heated, attaching a number of alignment balls or alignment bullets to the annular ring shaped alignment pads.

REFERENCES:
patent: 5191511 (1993-03-01), Sawaya
patent: 5558271 (1996-09-01), Rostoker et al.
patent: 5642265 (1997-06-01), Bond et al.
patent: 6354844 (2002-03-01), Coico et al.

Affiliated with

Also associated with

Rating

Methods for providing an integrated circuit package with an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for providing an integrated circuit package with an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for providing an integrated circuit package with an... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3433829